| 摘要 |
This invention relates to a method for molding or curing a resin material using a multilayer release film as a barrier at the surface of the resin material. In one embodiment, the method comprises the surface of the resin material being in contact with the release film at a temperature of at least about 350° F. (about 180° C.). Here, the release film is non-oriented and comprises: (1) an enhancement layer which comprises a thermoplastic material; and (2) a first release layer which has a composition that is different from the enhancement layer, comprises a polymeric material, and is releasable from the resin material after the resin material is molded or cured.This invention also relates to a release film that may be used, for example, with the above method. In one embodiment, the release film comprises 5 layers in the following order: (1) a first release layer which comprises polymethylpentene; (2) a first tie layer which comprises (i) polyethylene or modified polyethylene, and (ii) polypropylene or modified polypropylene; (3) an enhancement layer which comprises polyamide; (4) a second tie layer which comprises (i) polyethylene or modified polyethylene, and (ii) polypropylene or modified polypropylene; and (5) a second release layer which comprises polymethylpentene.
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