SOLID-STATE IMAGING DEVICE, ITS MANUFACTURING METHOD, IMAGE READING UNIT AND IMAGING DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a solid-state imaging device in which optical imaging quality is not deteriorated by the mixing of bubbles into an adhesive. SOLUTION: The solid-state image sensing device in which the pixel effective region 75a of a CCD bare chip 75 is opposed to a glass board 71, the transparent adhesive S1 is interposed between the CCD bare chip 75 and the glass board 71 and the CCD bare chip 75 is mounted on the glass board 71 contains the light transmitting region of the transparent adhesive S1 and has a space section S penetrated to one side faces of the mutually opposed CCD bare chips 75.