发明名称 LEAD TERMINAL, LEAD FRAME AND ELECTRONIC COMPONENT
摘要 <p>PROBLEM TO BE SOLVED: To provide lead terminal provided with a terminal part which can be force-fitted to a substrate, a lead frame with which the lead terminal can be assembled to both of the surfaces, three surfaces or four surfaces of the substrate and an electronic component obtained by mechanically coupling the substrate and the lead terminals. SOLUTION: The lead terminal consists of a metal plate obtained by successively providing a terminal at a lead. The terminal consists of a soldering part provided successively to the lead and the terminal part erected from this soldering part. The terminal par has a pair of joint parts approaching and separating from each other via a notch formed on the side of a top.</p>
申请公布号 JP2002270751(A) 申请公布日期 2002.09.20
申请号 JP20010070871 申请日期 2001.03.13
申请人 FUJITSU DENSO LTD 发明人 SHIOTANI TAKEHIKO
分类号 H01L23/50;H01R12/06;(IPC1-7):H01L23/50;H01R12/32 主分类号 H01L23/50
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