| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a method and device for supporting a substrate, with which the risks of occurring heat cracks in a substrate can be reduced at supporting the substrate on an electrostatic chuck. SOLUTION: In this method, the substrate mounted on the electrostatic holder of a substrate-supporting device is supported by vacuum-attracting the substrate with the Coulomb force, by impressing a voltage upon the clampless holder This method includes a voltage-increasing step (1) for increasing the voltage impressed upon the cluck from a fiducial value to first value required for vacuum-attracting the substrate and a first-voltage maintaining step (2) of maintaining the voltage increased in the voltage increasing step (1) at the first values. In the voltage increasing step(1), the voltage is increased from the fiducial value to the first value in steps.</p> |
