INTEGRATED CIRCUIT DEVICE PREVENTING SHORT CIRCUIT EFFECTIVELY AND ITS FABRICATING METHOD

摘要

PROBLEM TO BE SOLVED: To provide an integrated circuit device comprising a microelectronic substrate and a conductive layer formed thereon. SOLUTION: The integrated circuit device comprises a microelectronic substrate 100, a conductive layer 107 formed thereon, an insulation layer 108 formed on the conductive layer 107 and including a protrusion extending above the conductive layer 107, and a side wall insulating region 110a provided on the side face of the conductive layer 107 contiguously to one side wall thereof and extending between the protrusion of the insulation layer 108 and the microelectronic substrate 100.