| 摘要 |
A method for manufacturing a semiconductor piece comprises the following processes of: forming a groove, which has a first groove portion and a second groove portion and which is on a surface of a shape not having an edge portion between the first groove portion and the second groove portion, by dry etching wherein a width of the first groove portion gradually decreases toward a rear surface from a surface of a substrate and the second groove portion is a groove portion connected to a lower portion of the first groove portion and is extended downwardly at a steeper angle than an angle of the first groove portion; sticking a holding member having an adhesive layer to the surface where the groove is formed; making the substrate thin from the rear surface of the substrate while the holding member is stuck; and peeling the surface and the holding member after the process of making the substrate thin. |
