| 摘要 |
PROBLEM TO BE SOLVED: To provide a non-solvent type under-filling material, having a sufficiently close adhesion with a polyimide film together with a silicon wafer, and a mold-processing property (having a low viscosity and possibility of invasion in a relatively short time), and applicable for a flexible base substrate consisting of a thin copper layer and a polyimide film layer, and an electronic part applied with the above under-filling material. SOLUTION: This under-filling material for COF(chip on film) mounting consists of a non solvent and non-filler-based organic material capable of filling a gap between a flexible base substrate having a circuit formed by a copper layer having <=9μm thickness and installed on the polyimide film, and an IC chip installed on it, having a close adhesion in a level that a silicon wafer is destroyed in a close adhesion test performed by laminating the polyimide film and the silicon wafer with the under-filling material, and exhibiting <=150 kb/mm<2> tensile elastic modulus of its cured film, and the electronic part applied with the above under-filling material is also provided.
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