| 摘要 |
A semiconductor device of the present invention comprises a flexible printed circuit having a first area part located in the center thereof, a second area part provided continuous thereto, and a third area part provided continuous to the first area part; a wiring pattern formed on a surface of the above-described flexible printed circuit; a semiconductor element mounted on a surface of the second area part; and a second semiconductor element mounted on a surface of the third area part, wherein the second area part is folded to a face side of a center area part, and the third area part is folded to a rear side of the second area part.
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