| 摘要 |
In a substrate-integration-type thin-film solar cell module wherein an element is directly formed on a transparent insulating substrate, wiring between a bus region and a terminal box is formed of a solder-plated copper foil. To ensure insulation between a device surface and the solder-plated copper foil, an insulating sheet buried in a filler is inserted in a gap therebetween. A glass nonwoven fabric sheet or a 160° C.-heat-resistant synthetic fiber fabric sheet can be used for the insulating sheet. Contact between an edge of an opening in a back protection cover and the wiring is prevented by positioning output wiring by means of an insulating sheet portion. An insulating sheet for preventing entrance of water from the opening is disposed at the opening.
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