发明名称 DEVICE FOR MANUFACTURING SEMICONDUCTOR LASER ELEMENT
摘要 PROBLEM TO BE SOLVED: To provide a device for manufacturing a semiconductor laser element that can produce high output and long service life semiconductor laser element, when manufacturing a semiconductor laser element with suppressed generation of COD. SOLUTION: This manufacturing device is provided with a cleaving chamber 11, where a laminated structure made of semiconductor material is cleaved, and working to form the cleavage end face of a resonator is conducted, a crystal growth chamber 12 where a compound semiconductor is subject to epitaxial crystal growth on the cleavage end face of the resonator to form an end face growth layer, and a relay chamber 15 for connecting the cleaving chamber 11 and crystal growth chamber 12. The three chambers 11, 12 and 15 are provided with an atmospheric gas supply part 20 for supplying a high-purity inert gas, such as an highly purified N2 gas of 20 ppb or lower in concentration of oxygen and 20 ppb or lower in moisture concentration, an inert gas supply line 27, a material gas supply line 30, etc.
申请公布号 JP2002344069(A) 申请公布日期 2002.11.29
申请号 JP20010142207 申请日期 2001.05.11
申请人 FURUKAWA ELECTRIC CO LTD:THE 发明人 HAMAKAWA SATOSHI;TOYOSAKI KOICHI;OKUBO NORIO
分类号 H01L21/205;H01S5/028;(IPC1-7):H01S5/028 主分类号 H01L21/205
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