ELECTRONIC DEVICE HAVING HEAT DISSIPATION STRUCTURE

摘要

Provided is an electronic device that includes: a housing that includes a metallic member; a battery pack that is disposed in the housing; a substrate that is disposed in parallel with the battery pack and includes at least one heat generating source; a heat dissipation plate that is disposed to overlap with at least a portion of the battery pack and the substrate, and is formed of a metallic material. Heat generated from the heat generating source may be dissipated to the battery pack through the heat dissipation plate. The electronic device includes an efficient heat dissipation structure that also contributes to the rigidity reinforcement and slimming of the electronic device, and can prevent an electric shock accident beforehand, which may be caused by an exterior of a metallic member. Other various embodiments may be made.

主权项

1. An electronic device comprising:
a housing including a metallic member; a battery pack disposed in the housing; a substrate disposed adjacent to the battery pack and includes at least one heat generating source; and a heat dissipation plate disposed to overlap at least a portion of the battery pack and the substrate, and is formed of a metallic material, wherein the heat dissipation plate is configured to dissipate heat generated from the heat generating source to the battery pack or a peripheral structure through the heat dissipation plate.