| 摘要 |
PROBLEM TO BE SOLVED: To provide a mounting method for BGA package wherein a BGA package can be mounted on a printed wiring board with stability regardless of the level of skill of personnel or the arrangement (layout) of BGA packages. SOLUTION: The mounting method for BGA package involves a process in which a BGA package 4 with bumps 3 attached to lands 2 laid out on a board 1 is prepared; a process in which a mask 5 having openings 5a whose width and height are substantially the same as the bumps 3 formed in positions corresponding to the bumps 3 is prepared; a process in which the bumps 3 on the board 1 are inserted into the openings 5a in the mask 5 and the rear face of the mask 5 abuts against the board 1; a process in which cream-like solder 6 is applied to the front face of the mask 5; a process in which a squeegee 7 is slid on the surface of the mask 5 in a specified direction to apply the solder 6 to the bumps 3; a process in which the mask 5 is removed from the board 1; and a process in which the BGA package 4 with the solder applied thereto is placed on and soldered to a printed wiring board. |
