| 摘要 |
<p>The invention relates to a method for the fixing of electronic circuits, for example chips, to a circuit board, ceramic substrate or similar, by means of an adhesive and device for carrying out said method. The adhesive (3) is placed on the chip (1), whereby the adhesive (3) is precisely distributed on the surface of the chip (1) with regard to thickness and applied shape. The chip (1) is dipped with the surface thereof to be coated directly into adhesive (3) which is retained in a pan (4) and is sufficient for at least one fixing.</p> |
