| 摘要 |
PROBLEM TO BE SOLVED: To provide a ceramics circuit board installing a small semiconductor device where a metallic circuit board whose conduction capacity is large can be installed on the surface of the board with high density, and realizing a small semiconductor device whose bonding strength (peeling strength) of the metallic circuit board is large and heat cycle characteristic is superior. SOLUTION: The height of the cross section of the metallic circuit board 4a is set to be (h) and pattern width to be (w), in the ceramic circuit board where the short side part of the cross section of the metallic circuit board 4a is bonded to the ceramic board 2 through a wax material 3. In that case, h/w is larger than '1' and the peeling strength of the metallic circuit board 4 is not less than 8 kN/m.
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