| 摘要 |
PROBLEM TO BE SOLVED: To provide a solid-state imaging device which is small and lightweight without spoiling the characteristic of a solid-state image sensor. SOLUTION: In the solid-state imaging device, a metal bump is installed at an electrode pad on a solid-state image sensor chip; an optical glass in which a concave groove or a convex bank is formed is arranged on the side of the light receiving face of the image sensor chip, to which an inner lead of a TAB tape is electrically connected via metal bump at the electrode pad; the image sensor chip and the peripheral part of the optical glass are bonded and sealed with a sealing resin; and the image sensor chip is airtightly sealed.
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