MICRO LEAD FRAME TYPE SEMICONDUCTOR PACKAGE AND FABRICATING METHOD THEREOF

摘要

PURPOSE: A micro lead frame type semiconductor package and a fabricating method thereof are provided to miniaturize a size of the semiconductor package by minimizing an area of an edge portion of a chip bonding pad. CONSTITUTION: A lead frame includes a chip bonding pad(40a) for bonding a semiconductor chip and a plurality of semiconductor package units having a plurality of leads(40b) apart from the chip bonding pad(40a). A plurality of alignment holes are formed around the lead frame. A plurality of holes are formed at each corner of the semiconductor package units. The first etch target portion(40a') is formed at a bottom portion of the lead frame. The second etch target portion(40b') is formed at bottom portions of the leads(40b). The third etch target portion is formed at an upper portion of the lead frame. A semiconductor chip(44) is adhered on an upper face of the chip bonding pad(40a) by using an adhesive(42). An earth line(48) is used for connecting the semiconductor chip(44) with the chip bonding pad(40a). A bonding wire(46) is used for connecting the semiconductor chip(44) with the lead(40b).