发明名称 Semiconductor circuit device, electronic device, electronic apparatus, and moving object
摘要 A semiconductor circuit device includes: a semiconductor substrate; and a first circuit block including an analog circuit as a component, a second circuit block including a digital circuit as a component, a connection pad, and a connection wire electrically connecting the connection pad with the first circuit block, all of which are arranged on the semiconductor substrate. The connection wire is provided so as not to overlap the second circuit block in a plan view.
申请公布号 US9484857(B2) 申请公布日期 2016.11.01
申请号 US201414534656 申请日期 2014.11.06
申请人 Seiko Epson Corporation 发明人 Itasaka Yosuke;Ishikawa Masayuki;Yamamoto Takehiro
分类号 H03B5/32;H03H9/10;H03H9/02;H03H9/05;H01L23/528;H01L23/00 主分类号 H03B5/32
代理机构 Harness, Dickey & Pierce, P.L.C. 代理人 Harness, Dickey & Pierce, P.L.C.
主权项 1. A semiconductor circuit device comprising: a semiconductor substrate; a first circuit block on the semiconductor substrate, the first circuit block including an analog circuit; a second circuit block on the semiconductor substrate, the second circuit block including a digital circuit; a connection pad on the semiconductor substrate; and a connection wire on the semiconductor substrate, the connection wire electrically connecting the connection pad with the first circuit block, wherein an entirety of the connection wire is laterally spaced apart from the second circuit block in a plan view, the connection pad is laterally shifted from a peripheral of the semiconductor substrate via the second circuit block in the plan view, the connection pad is electrically connected to a resonator located outside of the semiconductor substrate, the connection pad is provided between the first circuit block and the second circuit block in the plan view, and at least a portion of the connection pad is arranged in a recessed area of the first circuit block in the plan view.
地址 JP