发明名称 COMPOSITION FOR ELECTRONIC CIRCUIT BOARD AND ELECTRONIC CIRCUIT BOARD
摘要 PROBLEM TO BE SOLVED: To provide a composition for an electronic circuit board which can be burned at <=900 deg.C, and does not contain alkali metals and lead. SOLUTION: The composition for an electronic circuit board consists essentially of, by mass%, 40 to 100% glass powder and a 0 to 60% inorganic filler. The glass essentially consists of, by mass% based on the following oxide, 58 to 70% SiO2 , 15 to 30% B2 O3 , 5 to 10% Al2 O3 and 3 to 10% CaO, and does not contain alkali metals and lead.
申请公布号 JP2003026446(A) 申请公布日期 2003.01.29
申请号 JP20010215427 申请日期 2001.07.16
申请人 ASAHI GLASS CO LTD 发明人 USUI HIROSHI;ONODA HITOSHI;DOUYA YASUKO;NEGISHI SUKEYOSHI
分类号 C03C14/00;H05K1/03;(IPC1-7):C03C14/00 主分类号 C03C14/00
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