METHOD OF MANUFACTURING THIN-FILM DEVICE SUBSTRATE

摘要

PROBLEM TO BE SOLVED: To provide a method of manufacturing a thin-film device substrate which is capable of forming a thin-film device having good characteristics on a final substrate and rapidly removing a supporting substrate from the rear surface side of the final substrate without giving damage to the final substrate and the thin-film device layer. SOLUTION: After the supporting substrate 101 and the final substrate 103 are bonded together across an adhesive layer 102, a thin-film device layer A is formed on the final substrate 103. The thin-film device layer A is covered by a protective film 104 and the supporting substrate 101 is etched away selectively with respect to the protective film 104 and the adhesive layer 102. The protective film 104 and the adhesive layer 102 are thereafter removed.