SOLDERING METHOD AND SOLDERING DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a soldering method and a soldering device by which a part can be surely joined with a substrate and the long-term reliability be improved by preventing a lead-free solder from being peeled from a joint part when it is cooled and solidified. SOLUTION: A melted lead-free solder is applied to a joint between a substrate 11 and a part mounted onto the substrate 11, and the lead-free solder is cooled and solidified to solder the part onto the substrate 11. At this time, the lead-free solder applied to the joint is cooled by a gradually cooling part 26 while it is heated.