| 摘要 |
PROBLEM TO BE SOLVED: To provide a designing device for an electronic component, by which molding conditions for preventing displacement of a die pad can be determined, and the design cost and a time can be reduced. SOLUTION: A resin flow analyzing part 22 calculates the pressures caused by the flow of the resin in the upper and lower portions of a die pad by using the intrinsic coefficient of the thermosetting resin in the viscosity equation. A design variable change part 28 changes the intrinsic coefficient of the thermosetting resin so that the value of a target function can be improved using the pressures calculated by the resin flow analyzing part 22. Therefore, it becomes possible to find material characteristics of such a thermosetting resin that does not cause displacement of the die pad. Additionally, since modification of a molding jig or the like becomes unnecessary, the designing cost and the designing time can be reduced. |
