| 摘要 |
PROBLEM TO BE SOLVED: To obtain a high density printed wiring board having an excellent copper foil adhesive force and an extra-fine pattern having a good shape. SOLUTION: A method for manufacturing the printed wiring board comprises the steps of removing the copper foil of a copper-clad board by etching to retain its surface ruggedness, forming through holes and/or blind via holes through the board, surface-treating the board, then to a surface ruggedness to 1 to 7μm, electroless copper plating thereon in thickness of 0.1 to 2μm, then electrically copper plating to 0.5 to 3μm, adhering a plating resist, then adhering an electric copper plating to 6 to 30μm, releasing the plating resist, and removing a thin electric copper plating layer and an electroless copper plating layer by dissolving, and thereby forming a pattern of line/space=40/40μm or less and further 25/25μm or less. Accordingly, a copper pattern undercut is extremely small, and the high density printed wiring board having the excellent adhesive force of the copper can be obtained.
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