| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition for sealing a semiconductor having excellent fluidity and filling properties during molding. SOLUTION: This epoxy resin composition for sealing the semiconductor is characterized as follows. The epoxy resin composition is composed of (A) an epoxy resin, (B) a phenol resin, (C) a curing accelerator and (D) a molten spherical silica composed of (1) >=75 and <=85 wt.% of a molten spherical silica having >=60 and <80μm average particle diameter and <=0.5 logarithmic standard deviation, (2) >=10 and <=20 wt.% of a molten spherical silica having >=5 and <15μm average particle diameter and <=0.5 logarithmic standard deviation and (3) >=2 and <=8 wt.% of a molten spherical silica having >=1 and <5μm average particle diameter and <=0.5 logarithmic standard deviation and containing <=2 wt.% of a fine particulate silica having <=0.5μm particle diameter. The particle diameter is obtained according to a laser diffraction and scattering method.
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