| 摘要 |
The present invention discloses a thermal transfer interface having an integrally formed means for fastening and maintaining intimate thermal contact between a heat generating device and a heat-dissipating device. The interface of the present invention includes two components, a compressible thermal transfer component having a first thickness and an adhesive fastening component having a second thickness that is less than the first. The first component, the thermal transfer element, includes a base polymer matrix compound that is loaded with a thermally conducting filler that imparts thermally conductive properties to the net shape moldable material. The polymer base matrix is preferably a highly compressible material such as an elastomer. The second component of the present invention is a pressure sensitive adhesive component. The adhesive is applied adjacent to the thermal transfer element or in an alternating pattern throughout a base field of thermal transfer material. The adhesive component has a thickness that is less than the overall thickness of the thermal transfer material. When, the heat dissipating device with the present invention applied is pressed into contact with a heat generating surface the elastomer is compressed and maintained in the compressed state by the pressure sensitive adhesive material.
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