| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor package which has the superior transmission efficiency of high-frequency signal and high airtight reliability. SOLUTION: At a place of the inner surface of a frame body 2 below a through hole 2b, a shelf section 2b with a circuit board 6 disposed on its top face is provided. The circuit board 6 is such that a line conductor 6a with its one end part electrically connected to a central conductor 3b and the other end part electrically connected to a semiconductor element 5 is formed on the top face of an insulation board, and common-plane grounded conductors 6f are formed on both sides of the line conductor 6a nearly at the same distance from the line conductor 6a. The end face of the insulation substrate on the end part side is in contact with the inner surface of the frame body 2, and the common-plane grounded conductors 6f are electrically connected to the inner surface of the frame body 2 via an L-shaped conductive member 12 which is 2 to 15 mm apart from the central conductor 3b. |
