SEMICONDUCTOR DEVICE, ELECTRONIC CARD, AND PAD RE- ARRANGED SUBSTRATE

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor device capable of increasing an electrostatic rupture resistance. SOLUTION: This semiconductor device comprises a substrate 3, external terminals 15 installed in the substrate 3, internal wiring electrically connected to the external terminals 15, a semiconductor chip 5 mounted on the substrate 3 and electrically connected to the internal wiring, and an antenna wiring 41 installed at two corner parts of the substrate 3 adjacent to each other and grounded.