| 摘要 |
PURPOSE: A lead frame, a resin sealed die and a method for manufacturing a semiconductor device using the same are provided to be capable of completely removing the air remaining at the inner portion of a cavity portion when carrying out a resin molding process, for preventing an unfilled region and a void phenomenon from being generated at a package. CONSTITUTION: A lead frame is provided with an air vent formation region(32), and the first and second air vent(29,30) formed at the predetermined portions of the air vent formation region. When carrying out a resin molding process, one end portion of the first air vent is located at the inner portion of a cavity portion, so that the air remaining at the cavity portion is capable of being completely removed. |
