发明名称 Low water, high-solids, low solvent flooring adhesive
摘要 A reduced density, low water, high-solids flooring adhesive, comprising an intimately blended mixture of between 10 percent and 20 percent by weight of a high solids acrylic polymer characterized by having at least 70 percent by weight solids, between 10 percent and 20 percent of a tackifying resin for increasing initial adherence of the adhesive to the flooring, between 40 percent and 60 percent filler, between 0.25 and 2 percent of a gas, wherein the total amount of solids is no less than 80 percent by weight. The gas may be the decomposition product of hydrogen peroxide introduced into the adhesive during mixing.
申请公布号 US6566421(B1) 申请公布日期 2003.05.20
申请号 US19990418859 申请日期 1999.10.15
申请人 TRIANGLE PACIFIC CORP. 发明人 WEST WILLIAM OSBORNE
分类号 C09J4/00;C09J101/00;C09J133/04;(IPC1-7):C09J101/00 主分类号 C09J4/00
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