| 发明名称 |
METHOD AND APPARATUS FOR DIRECTLY JOINING A CHIP TO A HEAT SINK |
| 摘要 |
THE PRESENT INVENTION RELATES GENERALLY TO A NEW APPARATUS AND METHOD FOR DIRECTLY JOINING A CHIP (20) TO A HEAT SINK (10, 70, 170). MORE PARTICULARLY, THE INVENTION ENCOMPASSES AN APPARATUS AND A METHOD THAT USES A DOUBLE-SIDED, PRESSURE-SENSITIVE, THERMALLY-CONDUCTIVE ADHESIVE TAPE (42) TO DIRECTLY JOIN A CHIP OR SIMILAR SUCH DEVICE TO A HEAT SINK. |
| 申请公布号 |
MY115354(A) |
申请公布日期 |
2003.05.31 |
| 申请号 |
MY1995PI01094 |
申请日期 |
1995.04.26 |
| 申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
ANSON JAY CALL;STEPHEN H MEISNER;FRANK LOUIS POMPEO;JEFFREY ALLEN ZITZ |
| 分类号 |
H01L23/40;H05K3/34;H01L21/58;H01L23/367;H01L23/42;H01L23/498;H01L23/64 |
主分类号 |
H01L23/40 |
| 代理机构 |
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