| 摘要 |
PROBLEM TO BE SOLVED: To obtain a printed wiring board on which high-frequency devices can be mounted at a high density and which is free from crosstalk and is ideal for a circuit handing high-frequency signals without changing the conventional manufacturing process. SOLUTION: The printed wiring board is provided with signal line conductors 5 formed on a first insulating layer 4 selectively covering a first ground layer 2 extended on a substrate 1; shielding walls composed of first, second, and third shielding walls 3, 6, 8 which are extended along the conductors 5 on both sides of the conductors 5 at intervals and electrically connected to the first ground layer 2; and a second ground layer 11 electrically connected to the shielding walls, extended above the conductors 5 at an interval, and having a plurality of openings 11A having lengths of≤1/4 wavelength of the handled frequency and formed at intervals of≤1/4 wavelength of the handled frequency. COPYRIGHT: (C)2003,JPO
|
