| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing an inkjet recording head capable of improving the manufacturing efficiency and suppressing the cost. SOLUTION: This method comprises a process for forming a diaphragm 50 and a piezoelectric element 300 on one face of a silicon wafer 100 to be a fluid passage forming substrate 10, a process wherein a sealing substrate forming material 120 to be a sealing substrate 30 having a piezoelectric element holding section 31 for forming the piezoelectric element 300 is bonded to the face of the silicon wafer 100 at the side of the piezoelectric element 300 to form a bonded body 130 having a step section 130a formed thereon at the periphery of the silicon wafer 100, a process wherein the bonded body 130 is covered by a protection film 140 and the periphery of the protection film 140 is pressed against the step section 130a to be fixed thereto to detachably seal the protection film 140, a process for forming a pressurizing chamber 12 by applying anisotropic etching to the silicon wafer 100 from the other face, and a process for dividing the silicon wafer 100 and the sealing substrate forming material 120 in predetermined sizes. COPYRIGHT: (C)2003,JPO
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