发明名称 |
CAMERA MODULE AND MANUFACTURING METHOD THEREOF |
摘要 |
PROBLEM TO BE SOLVED: To provide a camera module provided with an imaging semiconductor element and a lens for forming an object image onto the imaging semiconductor element for preventing dust particles from being deposited onto the imaging semiconductor element to attain high image quality for a photographed image and to provide a manufacturing method thereof. SOLUTION: The camera module for generating an image signal from an imaged object image comprises; an imaging device 22 with a light receiving face 35; a mold resin 40A with the imaging device 22 mounted thereon and having an aperture 34B through which the light of an object image passes; a lens 27B for forming the object image onto the imaging device 22; a lens holder 25B for supporting and fixing the lens 27B and placed on the mold resin 40A; and an infrared ray filter 26 placed between the lens 27B and the light receiving face 35 and provided to the mold resin 40A. COPYRIGHT: (C)2003,JPO
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申请公布号 |
JP2003219284(A) |
申请公布日期 |
2003.07.31 |
申请号 |
JP20020016134 |
申请日期 |
2002.01.24 |
申请人 |
FUJITSU LTD |
发明人 |
ONODERA MASANORI;MORIYA SUSUMU;KOBAYASHI IZUMI;AOKI HIROSHI;YODA TOSHIYUKI;KAIYA HIROSHI |
分类号 |
H01L27/14;H04N5/335;(IPC1-7):H04N5/335 |
主分类号 |
H01L27/14 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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