发明名称 |
MANUFACTURING METHOD FOR SILICON EPITAXIAL WAFER |
摘要 |
PROBLEM TO BE SOLVED: To manufacture a silicon epitaxial wafer by suitably forming an oxide film for automatic doping prevention to a diffusion wafer. SOLUTION: In the manufacturing method of the silicon epitaxial wafer, a silicon epitaxial layer 9 is vapor grown on the main surface of the diffusion wafer 7 and the silicon epitaxial wafer 10 is manufactured. Of a main back surface side oxide film 42 formed on the main back surface side of the diffusion wafer 7 at the end of diffusion, the remaining part 42b from which a surface layer is removed is used for the automatic doping prevention, and the silicon epitaxial layer 9 is vapor grown on the main surface of the diffusion wafer 7. COPYRIGHT: (C)2003,JPO
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申请公布号 |
JP2003224073(A) |
申请公布日期 |
2003.08.08 |
申请号 |
JP20020023702 |
申请日期 |
2002.01.31 |
申请人 |
SHIN ETSU HANDOTAI CO LTD |
发明人 |
MASHIMA MASAKI;FUJIYA SHOICHI |
分类号 |
H01L21/205;(IPC1-7):H01L21/205 |
主分类号 |
H01L21/205 |
代理机构 |
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