发明名称 Thermal link assembly and cryostat using same
摘要 A thermal link assembly provides thermal connection between a first thermally conductive part to which it is secured, and a second thermally conductive part which is generally disk-shaped and has a peripheral cylindrical surface. The thermal link assembly includes an annular ring made of thermally conductive material, generally in a shape of a revolution with respect to an axis, including an annular base portion to be secured to the first part and a series of contact tongues arranged along the base portion. Each contact tongue has a stem and a head. The stem has i) a longitudinal axis extending generally parallel to the axis of the annular ring, ii) a first longitudinal end connected to the base portion, and iii) a second longitudinal end connected to the head. The head has a contact surface to be in contact with the peripheral cylindrical surface of the second part. The stem is capable of twisting and bending elastic deformation with respect to the longitudinal axis, so that the contact surface of the head is capable of tilting in any direction and displacing in the radial direction of the annular ring. The thermal link assembly further includes an annular band fitted around the annular ring for exerting a force to the head of each contact tongue so as to urge the contact surface of the head against the peripheral cylindrical surface of the second part.
申请公布号 US6604365(B2) 申请公布日期 2003.08.12
申请号 US20020279158 申请日期 2002.10.24
申请人 JP NAT ASTRONOMICAL OBSERVATOR;SUMITOMO HEAVY INDUSTRIES;OSHIMA PROTOTYPE ENGINEERING C 发明人 SEKIMOTO YUTARO;NARASAKI KATSUHIRO;NODA KAZUFUSA
分类号 H04B1/08;F17C3/08;F17C13/00;(IPC1-7):F25B19/00 主分类号 H04B1/08
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