| 摘要 |
PROBLEM TO BE SOLVED: To provide a mold releasing multi-layer film which is improved in plating properties in the post-process of a flexible wiring board. SOLUTION: In the mold releasing multi-layer film having a mold release side layer, an intermediate layer, and a mold release opposite side layer, the resin of the mold release side layer is poly(methyl pentene) or a methyl pentene-α-olefin copolymer; the resin of the intermediate layer is a copolymer of anα-olefin selected from ethylene, propylene, butene, pentene, hexene, and methyl pentene, a multi-component copolymer, an ethylene-(meth)acrylate copolymer, or an ethylene-vinyl acetate-(meth)acrylic acid copolymer; and the resin of the mold release opposite side layer is polypropylene. The resin of the intermediate layer has a melt flow rate of 0.3-10.0 g/10 min and a melting point of 50-150°C, the resin of the mold release side layer has Rockwell's hardness of 65-88 and a thickness of 10-100μm, and an adhesive resin layer is arranged between the mold rease side layer and the intermediate layer. COPYRIGHT: (C)2003,JPO
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