发明名称 Process for MSG-soldering and use of a shielding gas
摘要 The invention relates to MSG-soldering (metal shielding gas-soldering) of metallic materials with use of soldering and an electric arc with consumable electrode or non-consumable electrode, whereby a shielding gas that essentially consists of inert gas is used. According to the invention, the shielding gas contains at least one active gas component in addition to the inert gas. As active gases, oxygen and/or carbon dioxide can be used. The proportion of active gas in the shielding gas is preferably in the range of 0.01 to 0.5% by volume.
申请公布号 US6624387(B1) 申请公布日期 2003.09.23
申请号 US20000697595 申请日期 2000.10.27
申请人 LINDE AKTIENGESELLSCHAFT 发明人 TISCHLER FRIEDRICH
分类号 B23K1/00;B23K3/04;B23K9/16;B23K35/38;(IPC1-7):B23K35/38 主分类号 B23K1/00
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