发明名称 MECHANISM FOR MOUNTING ELECTRONIC COMPONENT
摘要 PROBLEM TO BE SOLVED: To provide an electronic component mounting mechanism suitable when an electronic component is attached and detached repeatedly for the purpose of conducting an efficient test, measurement or mounting for the electronic component. SOLUTION: In this electronic component mounting mechanism for bringing electric connection between a plurality of lead terminals 00a protruded from a main body of the electronic component 00 and other equipment, a laminate terminal 03 constituted by laminating a plurality of conductive plates 03a arranged at the number/pitch same to those of the plurality of lead terminals 00a with a plurality of insulation plates 03b interposed respectively between the plurality of conductive plates 03a is attached in the electronic component mounting mechanism, and the lead terminal 00a of the electronic component 00 is brought into pressure contact on the laminate terminal 03, using a pressing means 05. A press member 05f comprising an elastomer is used in a lead terminal pressing part of the pressing means 05. COPYRIGHT: (C)2004,JPO
申请公布号 JP2003279620(A) 申请公布日期 2003.10.02
申请号 JP20020085422 申请日期 2002.03.26
申请人 OPNEXT JAPAN INC 发明人 TAKECHI KEIZO;SATO RYOZO;ASAUE TAKAMITSU;AMIMOTO TOSHIYUKI;YOSHIOKA TAKASHI
分类号 G01R31/26;G01R1/06;G01R1/073;(IPC1-7):G01R31/26 主分类号 G01R31/26
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