发明名称 PACKAGE WITH ATMOSPHERE-IMPROVABLE TAPE AND ITS MANUFACTURING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a package with an atmosphere-improvable tape which can employ many kinds of atmospheric improvable substances while the substances do not contaminate the surroundings of the package. SOLUTION: The package 1 with the atmosphere-improvable tape includes a package body 2 and the atmosphere-improvable tape 10. The package body 2 is formed by heat-bonding two overlapping sheets 20 and 21 at their end rims. The body 2 is provided with a lateral heat seat 23 formed by heat-bonding the sheets 20 and 21 to each other, and the tape 10 is heat-bonded inside the package body 2. The tape 10 includes an atmosphere-improvable layer 10A and a thermoplastic resin layer 10B, and the layer 10A has a cross section covered with the layer 10B. The end of the tape 10 in its extending direction is embedded in the lateral heat seal 23 of the sheets 20 and 21. COPYRIGHT: (C)2004,JPO
申请公布号 JP2003335376(A) 申请公布日期 2003.11.25
申请号 JP20020142943 申请日期 2002.05.17
申请人 IDEMITSU UNITECH CO LTD 发明人 YASUIKE TETSUO
分类号 B65D33/00;B31B1/20;B31B1/64;B31B1/90;B65D81/26;B65D81/28;(IPC1-7):B65D81/26 主分类号 B65D33/00
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