ORGANIC FILM MATERIAL, ORGANIC FILM FORMATION METHOD, PATTERN FORMATION METHOD, AND COMPOUND

摘要

PROBLEM TO BE SOLVED: To provide an organic film material for forming an organic film having dry etching resistance and also having a high level of embedding/flattening properties.SOLUTION: An organic film material comprises a compound represented by the formula (n1 and n2 are 0 or 1, W is a single bond or a structure represented by formula 2; Ris a structure represented by formula 3; m1 and m2 are an integer of 0-7; R-Rare H, alkyl or the like).SELECTED DRAWING: None