| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of mounting electronic component elements which can satisfactorily bond a Au bump of electronic component elements to a connection pad of a circuit board. SOLUTION: An electronic component element 4 can be mounted through the process that the circuit board defining an electronic component element 4 mounting region and a non-mounting region is placed on a stage 10 and the process that the non-mounting region among the upper surface of the circuit board 1 is pressed to the lower side with a clamping holder 13, thereafter, while the circuit board 1 is being pressed with the clamping holder 13, the electronic component element 4 having the Au bump 5 at the lower surface thereof is held with a bonding head 14 and is placed on the mounting region of the circuit board 1 and moreover the Au bump 5 is thermocompression-bonded to the connection pad of the circuit board 1 by applying heat to the Au bump 5 of the electronic component element 4 while the upper surface of the electronic component element 4 is pressed with the bonding head 14. COPYRIGHT: (C)2004,JPO
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