发明名称 DEVICE FOR QUENCHING INTERNAL CIRCUMFERENTIAL SURFACE
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a device for quenching an internal circumferential surface, which forms a continuous uniform pattern of a quench hardened layer, on the part having the smallest diameter and the tapering part of the internal circumferential surface of a through-hole in an annular component that is an object to be quenched, without placing a high-frequency induction heating coil so as to deviate (decenter) from the center of the above internal circumferential surface. <P>SOLUTION: This device has the high-frequency induction heating coil 22 consisting of a serially connected structure comprising a first and a second lead part 30 and 31 connected to a high-frequency power source, a first to a tenth conductor parts 32 to 41 for heating, and a connecting conductor part 42. The quenching method comprises inserting and placing the coil 22 in a hollow center of the through-hole 2 of the annular component (for example, the outer ring 1 of a hub unit); induction-heating the internal circumferential surface 2a in the through-hole 2 having the part with the smallest diameter 6 and a pair of tapering parts 7a and 7b, with the high-frequency power; and cooling it to quench the internal circumferential surface 2a of the through-hole 2. <P>COPYRIGHT: (C)2004,JPO</p>
申请公布号 JP2004010928(A) 申请公布日期 2004.01.15
申请号 JP20020163717 申请日期 2002.06.05
申请人 DENKI KOGYO CO LTD 发明人 SAWATSUBASHI SEIICHI;KATANUMA HIDEAKI
分类号 C21D1/10;C21D1/62;C21D9/40;(IPC1-7):C21D1/10 主分类号 C21D1/10
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