POSITIVE PHOTORESIST COMPOSITION, SUBSTRATE WITH PHOTOSENSITIVE FILM, AND METHOD FOR FORMING RESIST PATTERN

摘要

PROBLEM TO BE SOLVED: To provide a positive photoresist composition with which a pattern having a good vertical profile is formed when a resist film of ≥3.0 μm thickness on a substrate having surface level fluctuation is formed into a pattern having ≤0.8 μm width, and the pattern shows no dependence on baking treatment, and also to provide a substrate with a photosensitive film and a method for forming a resist pattern.

SOLUTION: The positive photoresist composition contains (A) an alkali-soluble novolac resin in which part of hydrogen atoms in the whole phenolic hydroxyl groups are substituted with 1,2-naphthoquinone dioxide sulfonyl groups. The alkali soluble novolac resin (A) shows ≤3.0 dispersion degree [weight average molecular weight (Mw)/number average molecular weight (Mn)].

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