PREPARATION METHOD OF POLY(AMIDE-IMIDE) WITH IMPROVED ADHESIVE STRENGTH

摘要

PURPOSE: A method for preparing a poly(amide-imide) and a poly(amide-imide) prepared by the method are provided, to improve the adhesive strength and the viscosity of a polyamideimide for enhancing the durability when used as the heat resistant coating materials of cooking utensils or the insulating coating materials of an electric wire. CONSTITUTION: The method comprises the steps of reacting 1 equivalence of 4-trimellitoyl halide anhydride, 0.9-1.1 equivalence of at least one kind of aromatic diamine and 0.01-0.1 equivalence of acetic anhydride at a temperature of -10 to 120 deg.C for 0.5-12 hours to prepare poly(amide-amic acid); preparing poly(amide-imide) by the imidation of the poly(amide-amic acid); and adding an adhesive strength enhancer having a triazole structure to the obtained poly(amide-imide). Preferably the aromatic diamine is at least one selected from the group consisting of m-phenylene diamine, p,p'-oxybisaniline and p,p'-methylene bisaniline; and the adhesive strength enhancer is at least one selected from the group consisting of 8-azaadenine, benzotriazole and benzotriazole-5-carboxylic acid.