摘要 |
CERAMIC SEMICONDUCTOR PACKAGES WHICH COMPRISE A LEAD FRAME (1) HAVING REGISTERING HOLES (4,5) AND A CERAMIC SUBSTRATE (2) HAVING A THERMALLY FUSIBLE BONDING MATERIAL SUCH AS A RESIN OR GLASS APPLIED TO THE SEALING SURFACE (6) OF THE SUBSTRATE ARE MANUFACTURED BY POSITIONING THE LEAD FRAME, USING A TRANSFER DEVICE (14), ON A LEAD FRAME-SUPPORTING PLATE (11) HAVING HOLES (20,21), THROUGH WHICH POSITIONING PINS (22) FORMED ON A POSITIONING BASE (12) ARE MADE TO PROTRUDE BY LIFTING THE BASE (12) BY A DRIVING MECHANISM (13), IN SUCH A MANNER THAT THE POSITIONING PINS PASS THROUGH THE REGISTERING HOLES (4,5) OF THE LEAD FRAME. THE SUBSTRATE IS THEN CENTERED AND POSITIONED ON THE LEAD FRAME USING A TRANSFER DEVICE (15) HAVING CHUCK HANDS (33). THEREAFTER, THE BONDING MATERIAL IS FUSED BY HEATING IN A HEATING FURNACE (16) TO BOND THE LEAD FRAME AND THE SUBSTRATE. (FIG 1) |