| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To solve the prior-art problem that in a semiconductor device where an electrode on a semiconductor pellet and a lead are connected through a conductive stripe via a viscous conductive bonding agent, when width of the lead is narrow, the bonding agent hangs down from the lead to bring the electric connection of the conductive stripe into an unstable state. <P>SOLUTION: The semiconductor device is adapted such that in a semiconductor device where both ends of conductive stripes 17, 18 are electrically connected to electrodes 11b, 12b on a semiconductor pellet 11 and one end of each of leads 15a, 15b, and 16a, 16b via conductive bonding agents 19, 20, a conductive bonding agent 20 between the conductive stripes 17, 18 and the leads 15a, 15b, and 16a, 16b is obtained by solidifying the viscous conductive bonding agents 20a, 20b with different viscosities. <P>COPYRIGHT: (C)2004,JPO</p> |
