METHOD FOR MANUFACTURING LOW-PROFILE CIRCUIT DEVICE USING CONDUCTIVE WIRING LAYER HAVING ANCHORING EFFECT

摘要

PURPOSE: A method for manufacturing a low-profile circuit device using a conductive wiring layer having an anchoring effect is provided to enhance the anchoring effect between the conductive wiring layer and a sealing resin layer by forming an inverted inclined surface of a photoresist layer on the conductive wiring layer. CONSTITUTION: A substrate having a laminated structure of the first conductive layer(11) and the second conductive layer(12) is prepared. A photoresist layer(PR) is formed on the second conductive layer. A conductive wiring layer(14) is selectively formed at an opening of the photoresist layer. An inverted inclined surface(14R) is formed around the conductive wiring layer. The second conductive layer is removed by using the conductive wiring layer as a mask. A semiconductor element is fixed on the first conductive layer. An electrode of the semiconductor element is electrically connected to the conductive wiring layer. The semiconductor element is covered with a sealing resin layer. An anchoring effect is produced at the inverted inclined surface of the conductive wiring layer by the sealing resin layer. The first conductive layer is removed to expose the second conductive layer positioned on a rear surface of the sealing resin layer and the conductive wiring layer.