| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To solve a problem that an electric connection defect occurs in a board incorporating a capacitor element. <P>SOLUTION: A plurality of insulating layers 3 formed of organic materials are laminated and wiring conductors 4 are formed on the surfaces of the insulating layers 3. The wiring conductors 4 positioned on and under the insulating layer 3 are electrically connected through a through conductor 5 formed in the insulating layer 3. The multilayer wiring board 9 incorporating the capacitor element 8 having an lead-out electrode 10 which is electrically connected to the wiring conductor 4 or the through conductor 5 is arranged inside a hollow part 7 disposed on at least one layer of the insulating layer 3. In the insulating layers 3 positioned above and below the capacitor element 8, coating layers 2 obtained by connecting liquid crystal polymer fibers by polyphenylene ether organic materials are formed on upper/lower faces of a liquid crystal polymer layer 1. <P>COPYRIGHT: (C)2004,JPO</p> |
