Integrated circuit chip and fabrication method

摘要

An integrated circuit chip includes a substrate die and integrated circuits and a layer incorporating a front electrical interconnect network formed on a front face of the substrate die. A local electrical connection via made of an electrically conductive material is formed in a hole of the substrate die. The via is linked to a connection portion of the electrical interconnect network. An electrical connection pillar made of an electrically conductive material is formed on a rear part of the electrical connection via. A local external protection layer at least partly covers the electrical connection via and the electrical connection pillar.

主权项

1. An integrated circuit chip, comprising:
a substrate die; integrated circuits and a layer incorporating a front electrical interconnect network on a front face of the substrate die; at least one rear electrical connection structure comprising:
an electrical connection via passing through the substrate die and linked to a connection portion of said front electrical interconnect network;a rear electrical connection pillar formed on the electrical connection via;a local rear protection layer at least partly covering the electrical connection via and the electrical connection pillar; andwherein the electrical connection via and the rear electrical connection pillar are formed of a same metal material.