发明名称 APPEARANCE INSPECTION APPARATUS AND APPEARANCE INSPECTION METHOD
摘要 PROBLEM TO BE SOLVED: To provide an appearance inspection apparatus used for an inspection process of a semiconductor manufacturing apparatus and inspecting a fine electronic circuit pattern in a semiconductor chip formed on a wafer. SOLUTION: A moving part places an inspection object having the pattern. An imaging part picks up an image of the inspection object placed by the moving part. A calculating and processing means processes the image picked up by the imaging part, extracts the pattern of the inspection object from the image picked up by the imaging part, implements a layer edit process for the pattern of the inspection object and sets an area. COPYRIGHT: (C)2004,JPO
申请公布号 JP2004132950(A) 申请公布日期 2004.04.30
申请号 JP20030139276 申请日期 2003.05.16
申请人 TOPCON CORP 发明人 ISHII TAKAAKI
分类号 G01B11/02;G01B11/24;G01B11/30;G01N21/956;G06T1/00;G06T3/00;H01L21/66;(IPC1-7):G01N21/956 主分类号 G01B11/02
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