BONDING METHOD OF FLIP-CHIP MANNER FOR SEMICONDUCTOR APPARATUS IN LATERAL BONDED TYPE, MEMS PACKAGE USING THE SAME, AND PACKAGING METHOD

摘要

PURPOSE: A bonding method of flip-chip manner for a semiconductor apparatus in lateral bonded type, MEMS(Micro Electro Mechanical System) package using the same, and packaging method are provided to be capable of fixedly attaching the upper and lower substrate of the MEMS package regardless of the surface state of the substrates. CONSTITUTION: The first UBM(Under Bump Metallurgy) parts(400b) are formed along an adhesive line on a lower substrate(200). A solder part(500) is formed by carrying out a plating process on the UBM part. A trench is formed at an upper substrate(100) corresponding to the solder part. Then, the second UBM part is formed at the trench. The solder part of the lower substrate is inserted into the trench of the upper substrate. Then, the upper and lower substrate are attached to each other by heating the solder part to a melting point, or higher. At this time, the trench is wetted by the solder part to the lateral direction.